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The Systel Advantage

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10 Point Survivor Technology

10 Point Survivor Technology



  • Electro-Mechanical Packing Design and Verification Process Systel's Engineering Team is the culmination of years of experience and in-depth working knowledge of electrical and mechanical design. Our rugged chassis designs are the result of vast customer and application experience. Our engineers work closely with the customer to bring the desired system to reality using the following processes: 
    • Full FEA / Thermal Simulations
    • Inventor 3D Modeling for All Designs
    • Component Compatibility Verification for the Intended Application
    • In-House Shock and Vibration Testing for Design Qualification
    • In-House Thermal Chambers for Design Qualification Over Extended Temperature
    • Use of Locked BOMs and Revision Controls

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  • Systel’s engineering and production pays particular attention to the routing of cables within the chassis for effective air flow considerations. We also make extensive use of dedicated cable tie downs (bridges) in our designs to ensure adequate strain relief and to eliminate cable pinching.

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  • Shock Mounting of Storage Arrays All drives, passive backplanes, and some motherboards are shock mounted to the chassis. Proper shock mounting of critical components is necessary to survive harsh environments.

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  • All add-in boards and some memory modules are secured through the use of hold down bars and clamps. Clamps utilize specially designed grommets for proper stabilization of boards as well as the memory modules. When necessary, we employ dual hold down bars to allow securing of full-length boards and provide a secondary role as chassis stiffeners.

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  • All Systel designs incorporate advanced thermal technology. Temperature testing is performed at 50° C for a minimum of 24 hours with a maximum load as part of the qualification process. All Systel systems are designed and built to allow for maximum air flow, ensuring continuous operation at wide temperature ranges.

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  • Electronics & Cable RTV Process Systel makes extensive use of RTV (Room Temperature Vulcanizing) for securing cables that are not locked down. This process is also used for certain electronic components on PC boards to ensure operation under demanding shock and vibration conditions.

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  • Burn In Process
    Prior to final test, all Systel computers go through a 24-hour computer controlled burn in period at 50° C with full diagnostics to identify and eliminate infant mortality. For certain applications, the burn-in process is extended to 48-72 hours.

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  • Systel designs its own boxes and packaging inserts to ensure reliable shipments of its products world-wide.

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  • Systel designs its own boxes and packaging inserts to ensure reliable shipments of its products world-wide.

    Can’t find what you need?

    Give us a call

    1.888.645.8400

    Or send us an email

    Contact Us

  • Supply Chain Management Services Systel has a robust program for counterfeit risk mitigation and EOL management of parts. From sourcing long life components to last time buys, Systel can provide a custom solution for your application.

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    1.888.645.8400

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