Systel introduces the IPC 91240 ATCA Platform, the most ruggedized Advanced TCA (ATCA) solution for mission critical military and extreme industrial applications. Systel Inc uses the highest quality and performing components available in the industry, including the Intel Xeon® Processor 5500 series and the all new Xeon® Processor 5600 series. 50°C operation is kept under control by a PUSH/PULL fan tray arrangement designed for 400 watts per slot. Using the Advanced TCA PICMG 3.0 revision 3.0 specifications, the IPC 91240 ATCA platform is designed with over 95% aluminum content to minimize weight, and in some cases is 45% lighter than the competition. A shock mounted sub-shelf provides full protection to all electronic parts and power entry modules. Mounting options include rack slides or mounting flanges that can be located front, mid or at the rear of the chassis.

•	14 Slot Chassis with Positive Pressure Cooling
•	13U chassis designed for military and harsh industrial environments
•	14 slot dual star backplane, other options available
•	Dual shelf manager modules with status LEDs
•	Latest Intel processors
•	Front and rear cable management trays
•	Quad power entry modules
•	10 Point Survivor Technology
•	0-50°C operating temperature

CHASSIS

•	Material: .060 5052-H32 aluminum with gold alodine finish. Front panel color black or custom
•	Fan Tray LED's: Bi-color LED for fan status on each fan tray
•	Shelf Mgr LED's: Minor, Major, Critical, Shelf Manager Status, FRU Status (programmable) and Hot/ Swap LED (Blue LED)
•	Controls: Power & reset ON/OFF switch
•	Rack Slides: Specified by customer if required
•	Dimensions: (W x D x H) 19" x 17.35" x 22.75"
•	Weight: 57lbs (Bare chassis w/ power modules, backplane, and shelf managers)

BACKPLANE

•	14 slot dual star backplane Two center fabric slots Twelve node slots Optional backplanes available

COOLING

•	Bottom: 6 x 200CFM fans ( 2 fans per tray)
•	Top: 12 x 47CFM fans ( 4 fans per tray)
•	Filter:Washable fan filter in lower tray

RUGGEDIZATION

•	Systel:10 Point Survivor Technology

ELECTRICAL

•	Power Input:Four each rear shock-mounted -48VDC power modules. Other voltage options available
•	Cable Management:Front and rear cable trays
•	Card Eject:Releases cards to clear backplane connec tors before removal from chassis
•	ESD:Front and rear ESD ports

SHELF MANAGER

•	Dual redundant shelf managers
•	Executes on an IPM Sentry ShMM-300 device
•	Micro DB15 Telco Alarm interface
•	Dual Ethernet and RS232 interfaces
•	LED's to indicate Minor, Major and Critical status

ENVIRONMENT

•	Temperature: 0 to 50° C
•	Humidity: 5% to 95% non-condensing
•	Altitude: Up to 15,000 feet
•	Shock:Method 516.5, Procedure 1 (10G, 11rms) a and Procedure 2
•	Vibration:Method 514.5, Category 4, Procedure 1 Sinusoidal per 514.5B 2.3.2 Random per 514.5B 2.3.1 & 514.5C-3

Designed to meet MIL-STD-810F Shock and Vibration

Note:Systel maintains an on-site environmental lab for shock and vibration testing. As an added benefit we can test the many different combinations for operating and non-operating profiles to meet transportation, airframe and shipboard applications.

13U Extreme Industrial Rack Mount ATCA Platform